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Plating seed layer coating material 'COP-CF'

Roll to Roll manufacturing by Daikota!

"COP-CF" is a coating material for a plating seed layer that uses COP with excellent high-frequency characteristics. It is suitable for applications such as high-frequency transparent substrates and demonstrates high adhesion strength due to the use of a dedicated plating seed layer. [Adhesion Strength] ■ Peel Strength: 6N/cm or more ■ Notes: 10mm width, 25mm/min, 90-degree peel *For more details, please download the PDF or feel free to contact us.